Physical Scaling Limits of FinFET Structure: A Simulation Study
نویسندگان
چکیده
In this work an attempt has been made to analyze the scaling limits of Double Gate (DG) underlap and Triple Gate (TG) overlap FinFET structure using 2D and 3D computer simulations respectively. To analyze the scaling limits of FinFET structure, simulations are performed using three variables: finthickness, fin-height and gate-length. From 2D simulation of DG FinFET, it is found that the gate-length (L) and fin-thickness (Tfin) ratio plays a key role while deciding the performance of the device. Drain Induced Barrier Lowering (DIBL) and Subthreshold Swing (SS) increase abruptly when (L/Tfin) ratio goes below 1.5. So, there will be a trade-off in between SCEs and oncurrent of the device since on-off current ratio is found to be high at small dimensions. From 3D simulation study on TG FinFET, It is found that both fin-thickness (Tfin) and fin-height (Hfin) can control the SCEs. However, Tfin is found to be more dominant parameter than Hfin while deciding the SCEs. DIBL and SS increase as (Leff/Tfin) ratio decreases. The (Leff/Tfin) ratio can be reduced below 1.5 unlike DG FinFET for the same SCEs. However, as this ratio approaches to 1, the SCEs can go beyond acceptable limits for TG FinFET structure. The relative ratio of Hfin and Tfin should be maximum at a given Tfin and Leff to get maximum on-current per unit width. However, increasing Hfin degrades the fin stability and degrades SCEs.
منابع مشابه
Review of Fin FET Technology and Circuit Design Challenges
Considering the difficulties in planar CMOS transistor scaling to secure an acceptable gate to channel control FinFET based multi-gate (MuGFET) devices have been proposed as a technology option for replacing the existing technology. The desirability of FinFET that it’s operation principle is same as CMOS process. This permits to lengthening the gate scaling beyond the planar transistor limits, ...
متن کاملSub 50 - nm FinFET : PMOS ( revised 12 / 9 / 1999 )
High performance PMOSFETs with a gate length as short as 18-nm are reported. A self-aligned double-gate MOSFET structure (FinFET) is used to suppress the short channel effect. The 45 nm gate-length PMOS FinFET has an Idsat of 410 PA/Pm (or 820 PA/Pm depending on the definition of the width of a double-gate device) at Vd = Vg = 1.2 V and Tox = 2.5 nm. The quasi-planar nature of this variant of t...
متن کاملSub - 50 nm P - Channel FinFET
High-performance PMOSFETs with sub-50–nm gate-length are reported. A self-aligned double-gate MOSFET structure (FinFET) is used to suppress the short-channel effects. This vertical double-gate SOI MOSFET features: 1) a transistor channel which is formed on the vertical surfaces of an ultrathin Si fin and controlled by gate electrodes formed on both sides of the fin; 2) two gates which are self-...
متن کاملPerformance Comparison of Bulk Finfet with Soi Finfet in Nano-scale Regime
This paper describes the characteristics comparison of bulk FINFET and SOI FINFET. The scaling trend in device dimension require limit on short channel effect through the control of subthreshold slope and DIBL characteristics.It can be achieved by proper device design. The subthreshold characteristics are plotted with the variation of gate voltage for different doping profile .This paper also c...
متن کاملAn Investigation of Super-Threshold FinFET Logic Circuits Operating on Medium Strong Inversion Regions
Abstract: Scaling supply voltage of FinFET circuits is an efficient method to achieve low power dissipation. Superthreshold FinFET logic circuits can attain low power consumption with favorable performance, because FinFET devices operating on medium strong inversion regions can provide better drive strength than conventional CMOS transistors. The supply voltage of the super-threshold circuit is...
متن کامل